Metal fusion bonding – With control means responsive to sensed condition
Patent
1985-08-08
1987-04-21
Godici, Nicholas P.
Metal fusion bonding
With control means responsive to sensed condition
228 36, 228 39, 228 561, 228 565, 228264, 118429, 164312, 222594, B23K 108, B23K 3706
Patent
active
046590021
ABSTRACT:
An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask having at least one hole extending therethrough and the hole being aligned with the component. A conduit is provided for directing liquid solder into the hole in the mask to contact leads of the component and thus facilitate installation or removal thereof from the board.
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Fridman Robert
Siegel William J.
Wallgren Linus E.
Ferguson Jr. Gerald J.
Godici Nicholas P.
Heinrich Samuel M.
Hoffman Michael P.
Malamud Ronni S.
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