Apparatus for removing solder from the drill holes of empty prin

Details Apparatus for removing solder from the drill holes of empty prin Apparatus for removing solder from the drill holes of empty prin

1984-11-09

1987-11-03

Lawrence, Evan K.

Coating apparatus

With manipulation of work after coating to distribute or...

Vibrating or jarring

118641, B05C 1108

Patent

active

047037148

ABSTRACT:
During the pre-soldering or tinning of printed circuit boards, as a rule, also the drill holes or bores and, in particular, the through-metallized drill holes are filled in an undesirable manner with solder. This solder must be removed before mounting the electrical components or elements upon the printed circuit boards. A simple apparatus is disclosed for this purpose, affording a faultless de-soldering of the drill holes, without deleteriously affecting the properties of the solder material. The printed circuit boards, in a condition where the solder applied during the pre-soldering operation is still molten, are accelerated at least once and thereafter suddenly brought to standstill in such a fashion that the excess solder is knocked or propelled out of the drill holes. The apparatus serves to guide the printed circuit board essentially horizontally in a frame and to accelerate such printed circuit board in a guided vertical drop or fall in the direction of an impact location, so that upon concussion of the frame at the impact location the excess solder is downwardly knocked or propelled out.

REFERENCES:
patent: 1397175 (1921-11-01), Mowry
patent: 2267273 (1941-12-01), Garbe
patent: 3226974 (1966-01-01), Bresk et al.
patent: 4129668 (1978-12-01), Rouquie 118 57

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