Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1991-05-08
1992-11-17
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156 94, 29762, 219230, 228264, B32B 3500
Patent
active
051640376
ABSTRACT:
Method and apparatus for vertically removing semiconductor integrated circuits (91) from high density multichip hybrid microcircuits without interfering with close proximity neighboring devices. An integrated circuit (91) is vertically removed by simultaneously applying tensile and torsional forces thereto. By using the present invention to transfer some of the tensile force torsionally, high density multilayer interconnect substrates (93) survive the rework process without damage. The present invention employs techniques which allow for accurate and repeatable removal of closely spaced integrated circuit devices. Removal of an integrated circuit (91) is accomplished by bonding a special thermode device (70, 70') directly to the integrated circuit (91) using a thermoset, or a thermoplastic, die attach material (90). Once the thermode (70, 70') has been attached, tensile and torsional forces are applied to the integrated circuit (91) through the attached thermode (70, 70'). Additionally, the method and apparatus of the present invention may be used with precision measuring equipment to accurately evaluate and measure adhesional strength over large surface areas of devices such as die mounting pads on high density multichip interconnect substrates.
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patent: 4934582 (1990-06-01), Bertram et al.
patent: 4954453 (1990-09-01), Venutolo
patent: 5072874 (1991-12-01), Bertram et al.
"A Review of Repairable Die Attach for CuPI MCM", by Thom A. Bishop, pp. 77-89, 1990.
Iwami Craig S.
Onda Edward J.
Denson-Low W. K.
Gudmestad Terje
Hughes Aircraft Company
Osele Mark A.
Simmons David A.
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