Apparatus for removing metallized leads bonded to metallized bon

Details Apparatus for removing metallized leads bonded to metallized bon Apparatus for removing metallized leads bonded to metallized bon

1994-07-21

1995-05-16

Cuda, Irene

Metal working

Plural diverse manufacturing apparatus including means for...

Binding or covering and cutting

294265, B23P 2304

Patent

active

054149193

ABSTRACT:
Lead wires extending out from an electrical circuit device are removed from respective bonding pads to which they are bonded by a lateral shearing action. Shearing can be accomplished either unidirectionally, or with a bidirectional reciprocating movement. A shearing tool is provided with a single shearing projection for a unidirectional shearing, or with a pair of spaced shearing projections for bidirectional shearing. A vertical alignment is established between the tool and a first lead to be sheared, and this initial alignment is also used for shearing the other leads of the device. With the actual bond between a lead and its bonding pad occupying only a minor portion of the available surface area, a subsequent lead from a replacement device is bonded to the same bonding pad as the first lead by forming a new bond at a different site along the pad.

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Dage Series 22 Microtester Data Sheet Reference 4/88/DB/0/1/5K by Dage Precision Industries Inc., 46701 Fremont Blvd., Fremont, Calif 94538 (8 pages).

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