Apparatus for removing marks from integrated circuit devices

Abrading – Machine – Combined

Patent

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Details

451300, 451336, 451337, 451339, 451449, B24B 706

Patent

active

059973889

ABSTRACT:
A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

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