Apparatus for removing interconnects to separate two parts...

Details Apparatus for removing interconnects to separate two parts... Apparatus for removing interconnects to separate two parts...

2011-02-08

2011-02-08

Phan, Thiem (Department: 3729)

Metal working

Means to assemble or disassemble

Multiple station assembly or disassembly apparatus

C029S721000, C029S759000, C029S762000

Reexamination Certificate

active

07882623

ABSTRACT:
Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

REFERENCES:
patent: 6063188 (2000-05-01), Heid
patent: 6304792 (2001-10-01), Mahanpour
patent: 6497357 (2002-12-01), Jackson et al.
patent: 6539618 (2003-04-01), Lyke
patent: 6719188 (2004-04-01), Farooq et al.
patent: 7299530 (2007-11-01), Farooq et al.

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