Apparatus for removing individual wafer segments from a framed c

Conveyors: power-driven – Conveyor system for arranging or rearranging stream of items – By longitudinally respacing successive articles in stream

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

198750, 206328, 221 74, 242 742, B65G 4731

Patent

active

047023651

ABSTRACT:
An apparatus for removing segments of a wafer adhering to an upper surface of a flat flexible carrier. The apparatus comprises a base supporting a separator plate disposed between a cassette-type conveyor and a support plate. The separator plate has a separator edge spaced apart from the conveyor to form a narrow gap. A take-up drum is rotatably mounted within the base and has a clamping member capable of gripping the leading edge of the flexible carrier. When the take-up drum is rotated by a powering mechanism the carrier is drawn along the support surface and into the narrow gap between the separator plate and conveyor. The carrier is framed to ensure that the carrier maintains its configuration during operation of the apparatus. The powering mechanism that rotates the take-up drum simultaneously actuates the conveyor. Thus, as the carrier is drawn into the narrow gap the segments of the wafer and the frame are peeled from the carrier and deposited onto the conveyor. Guides on the conveyor lift the frame to prevent contact of the frame with the wafer segments. The separator plate and support plate are at a descending angle of 4.degree. as measured from the edge of the conveyor adjacent the narrow gap.

REFERENCES:
patent: 1160792 (1915-11-01), Van Houten
patent: 1672522 (1928-06-01), Greer et al.
patent: 2059242 (1936-11-01), Jung
patent: 2503771 (1950-04-01), Roll
patent: 2542330 (1951-02-01), Henderson et al.
patent: 3187873 (1965-06-01), Wolff
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3606035 (1971-09-01), Gantley
patent: 4089725 (1978-05-01), Crankshaw et al.
patent: 4095926 (1978-06-01), Paul
patent: 4235328 (1980-11-01), Marshall

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for removing individual wafer segments from a framed c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for removing individual wafer segments from a framed c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for removing individual wafer segments from a framed c will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1267202

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.