Apparatus for removing heat from an integrated circuit package t

Details Apparatus for removing heat from an integrated circuit package t Apparatus for removing heat from an integrated circuit package t

1995-09-29

1997-04-01

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 361704, H05K 720

Patent

active

056172940

ABSTRACT:
An apparatus for removing heat from an integrated circuit package. In one embodiment, the present invention includes a heat slug that is capable of being installed within an opening in a printed circuit board using a standard pick-and-place machine. The surface mountable heat slug includes a top portion and a bottom portion, wherein the bottom portion is formed to fit within the printed circuit board opening. The top portion of the heat slug is attached to the top surface of the printed circuit board. The integrated circuit package is attached to the bottom portion of the heat slug which is exposed along the bottom surface of the printed circuit board.

REFERENCES:
patent: 4046442 (1977-09-01), Hutchison
patent: 4509096 (1985-04-01), Baldwin
patent: 4598308 (1986-07-01), James
patent: 5172301 (1992-12-01), Schneider
patent: 5293301 (1994-03-01), Tanaka
patent: 5306670 (1994-04-01), Mowatt

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