Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1989-08-14
1990-05-29
Tufariello, T. M.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C25D 1700
Patent
active
049293249
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to an apparatus for removing an electroplating metal deposited onto the surface of a conductor roll in a horizontal type electroplating apparatus for a metal strip.
BACKGROUND OF THE INVENTION
A horizontal type electroplating apparatus has widely been applied for electrogalvanizing purposes because of the merits thereof such as a smaller loss of voltage and the necessity of a lower strength of a conductor roll and a supporting roll as compared with a vertical type electroplating apparatus. FIG. 4 is a schematic vertical sectional view illustrating a conventional horizontal type electroplating apparatus used for electrogalvanizing a steel strip. As shown in FIG. 4, a conventional horizontal type electroplating apparatus comprises a plurality of horizontal type electroplating tanks 2, arranged in series, for receiving an electroplating solution 3 and a plurality of pairs of upper and lower anode plates 4 arranged in parallel with a steel strip 1 to be electroplated, which horizontally travels in the electroplating tanks 2, with the steel strip 1 therebetween. For the purpose of preventing flapping or loosening of the steel strip 1 caused by the long travelling distance of the steel strip 1 through the electroplating tank 2, a plurality of pairs of supporting rolls 8 are provided in the electroplating tanks 2 so as to pinch the steel strip 1 therebetween.
Near each of the inlet and the outlet for the steel strip 1 of the electroplating tank 2, a conductor roll 5 and a backup roll 6 are provided the former above the latter outside the electroplating tank 2 with the steel strip 1 therebetween. The steel strip 1 is electrically negatively charged by the conductor roll 5. An electrogalvanizing layer is formed on the surface of the steel strip 1 by the electrode reaction in the electroplating solution 3. To prevent the electroplating solution 3 from flowing to outside the electroplating tank 2 along with the steel strip 1, and to keep a constant level of the electroplating solution 3 in the electroplating tank 2, a pair of dam rolls 7 are provided one above the other at each of the inlet end and the outlet end of the electroplating tank 2 with the steel strip 1 therebetween.
Such a horizontal type electroplating apparatus is large in scale in general, comprising sequentially from 10 to 15 electroplating tanks 2 each having a length of 6 m, a width of 2.5 m and a depth of 1.0 m, thus requiring a very high cost for heating the electroplating solution 3 in a large quantity supplied into the electroplating tanks 2. Furthermore, since there is a long distance (1 m, for example) between the conductor roll 5 and the anode plates 4, partly because of the arrangement of the dam rolls 7 therebetween, resistance of the steel strip 1 itself causes a considerable loss of voltage.
With a view to overcoming these inconveniences, therefore, it is the recent tendency to try to reduce the scale of the horizontal type electroplating apparatus by switching over from the soluble electrode to the non-soluble electrode or to reduce the distance between the conductor roll 5 and the anode plates 4 by eliminating the dam rolls 7.
In the case of a horizontal type electroplating apparatus without the dam rolls 7, a couple of the conductor roll 5 and the backup roll 6 are provided, instead of the pair of dam rolls 7, the former above the latter at each of the inlet end and the outlet end of the electroplating tank 2 with the steel strip 1 therebetween, and another couple of the conductor roll 5 and the backup roll 6 are provided also between the plurality of pairs of anode plates 4 in the electroplating tank 2. Since the lower portion of the conductor roll 5 is immersed in the electroplating solution 3, an electroplating metal is deposited onto the surface of the conductor roll 5 during electroplating. Deposition of the electroplating metal onto the surface of the conductor roll 5 results in an insufficient electrical contact between the conductor roll 5 and the steel strip 1, and parti
Kawabe Masaki
Sagiyama Masaru
Takushima Shigehiro
Tsujihara Toshiyuki
Watanabe Tsutomu
NKK Corporation
Tufariello T. M.
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