Apparatus for removing electronic device from printed circuit bo

Metal working – Method of mechanical manufacture – Electrical device making

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29741, 228264, H05K 300, B23P 1900

Patent

active

054025630

ABSTRACT:
An apparatus for removing an electronic device from a printed circuit board includes a board support for supporting the printed circuit board with the first main surface thereof directed upwardly and for vertically moving the printed circuit board; a lower heating device for applying heat from the second main surface side of the printed circuit board; an upper heating device for applying heat from the first main surface side of the printed circuit board; a withdrawal device disposed on the first main surface side of the printed circuit board for applying a force to withdraw the electronic device from the printed circuit board, the withdrawal device detecting the withdrawal of the electronic device; and a solder elimination device disposed on the first main surface side of the printed circuit board, the solder elimination device comprising a hood for covering that portion of the printed circuit board where the electronic device is mounted, and a pressure control device for increasing or decreasing a pressure within an internal space of the hood to drive the solder out of the through holes by pressurization or suction.

REFERENCES:
patent: 3834605 (1974-09-01), Coffin
patent: 3879836 (1975-04-01), Coffin
patent: 4610388 (1986-09-01), Koltuniak et al.
patent: 4637542 (1987-01-01), Breske et al.
patent: 4805827 (1989-02-01), Coffman et al.
IBM Tech. Discl Bull vol. 20 No. 8 Jan. 1978 pp. 3028-3029 by P. L. Baron et al.

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