Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Radiated energy
Patent
1995-11-28
1997-01-28
Vargot, Mathieu D.
Plastic article or earthenware shaping or treating: apparatus
Means applying electrical or wave energy directly to work
Radiated energy
21912161, 21912162, 21912168, 264400, B23K 2608
Patent
active
055975909
ABSTRACT:
A method and apparatus whereby a thin film layer, e.g., a resist covering at least selected patterns formed on a surface of a substrate, e.g., a wafer is removed from a limited localized portion at a predetermined position relative to each of the patterns, such as, an alignment mark portion of the pattern in response to the irradiation of an energy beam. The substrate is positioned on a turn table and the position of a selected portion of the pattern is detected on the turn table. In accordance with the detected position of the selected portion and design coordinate position information of the pattern, the position of the localized portion requiring removal of the thin film layer is determined by means of a polar coordinate system based on a center of rotation of the turn table so that in accordance with the determined polar coordinate values the energy beam is irradiated on the thin film layer of the localized portion.
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Komaru Yukako
Motegi Kiyoshi
Tanimoto Akikazu
Meller Michael N.
Nikon Corporation
Vargot Mathieu D.
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