Apparatus for removing a heatsink from an electronic module or p

Details Apparatus for removing a heatsink from an electronic module or p Apparatus for removing a heatsink from an electronic module or p

1992-12-31

1994-03-29

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

361715, 361705, F28F 700

Patent

active

052976181

ABSTRACT:
A heatsink is provided which can be removably secured in a heat transfer relationship to an electronic module or package by an epoxy type adhesive. A screw is provided through one end of the heatsink directly over an edge of the module sealing cap. To remove the heatsink from the module, the screw is turned down to contact the cap. Continued turning causes a prying force between the cap and the module whereby the heatsink is peeled away and removed from the module. All forces are directed between the cap and the module thereby eliminating harmful stress from being transmitted through the solder ball connections and to a supporting circuit card.

REFERENCES:
patent: 2879977 (1959-03-01), Trought
patent: 3476177 (1969-11-01), Potzl
patent: 4069497 (1978-01-01), Steidlitz
patent: 4342068 (1982-07-01), Kling
patent: 4381032 (1983-04-01), Cutchaw
patent: 4475145 (1984-10-01), Heil et al.
patent: 4546410 (1985-10-01), Kaufman
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4854377 (1989-08-01), Komoto et al.
patent: 5018004 (1991-05-01), Okinaga et al.
patent: 5019940 (1991-05-01), Clemens
patent: 5089936 (1992-02-01), Kojima et al.
patent: 5109317 (1992-04-01), Miyamoto et al.
Durand, R. D., "Ceramic Cap and Heat Sink for Semiconductor Package", IBM Tech. Disc. Bull., vol. 21, No. 3, Aug. 1978, p. 1064.
Kunkler et al., "Fixture for Assembling Heatsing Module", IBM Technical Disclosure Bulletin, vol. 23 No. 8, Jan. 1981, pp. 1064-1065.

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