Apparatus for removal and installing electronic components with

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive

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2281802, 228 20, 219364, B23K 300

Patent

active

048999202

ABSTRACT:
This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

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patent: 4767047 (1988-08-01), Todd et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.

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