Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1988-02-22
1990-11-27
Ramsey, Kenneth J.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 565, 228 62, B23K 100
Patent
active
049729900
ABSTRACT:
Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.
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Abbagnaro Louis A.
Brown Robert G.
Kautter William J.
Quasney, Sr. Robert S.
Siegel William J.
Pace Incorporated
Ramsey Kenneth J.
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