Apparatus for reducing thermoplastic material compression mold c

Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Electro-static or inductive field

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

264 26, 264325, 425185, 425193, 425384, 425407, 425411, B29C 3308

Patent

active

051394073

ABSTRACT:
A thermoplastic sheet is placed between a pair of mold members each having a thermal insulator and a mating metal mold insert. RF energy is applied to the inserts to dielectrically heat and melt the thermoplastic sheet. The heated sheet is then deformed in a low pressure press with the insulators. The insulators are then replaced with cool thermally conductive structures to shorten the cooling cycle time. The thermally conductive structures cool the sheet by pressing the sheet in a high pressure press.

REFERENCES:
patent: 2920172 (1960-01-01), Stallard
patent: 2922865 (1960-01-01), Schattler et al.
patent: 3545044 (1970-12-01), Rebovich et al.
patent: 3553784 (1971-01-01), Shuman
patent: 3671624 (1972-06-01), Antalek
patent: 3804362 (1974-04-01), Stromblad et al.
patent: 4018552 (1977-04-01), Prast et al.
patent: 4134942 (1979-01-01), Mirr et al.
patent: 4202522 (1980-05-01), Hanas et al.
patent: 4225109 (1980-09-01), Yotsutsuji et al.
patent: 4240780 (1980-12-01), Carcey
patent: 4390489 (1983-06-01), Segal
patent: 4402657 (1983-09-01), Laghi
patent: 4416604 (1983-11-01), Bender et al.
patent: 4490321 (1984-12-01), Klinkau
patent: 4563145 (1986-01-01), de Meij
patent: 4629650 (1986-12-01), Kataoka
patent: 4659304 (1987-04-01), Day
patent: 4708626 (1987-11-01), Sakai et al.
patent: 4714421 (1987-12-01), D'Agostino
patent: 4744849 (1988-05-01), Michaud-Soret
patent: 4769202 (1988-09-01), Eroskey et al.
patent: 4773839 (1988-09-01), Case et al.
patent: 4874564 (1989-10-01), Sudani et al.
News Watch, Mike Berins, Plastics World, Aug. 1987, p. 13 Dupont Article.
Polym. Plast. Technol. Eng., 26(1), 1-22 (1987), Rajesh R. Wadha et al., A New Approach to Low Thermal Inertia Molding.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for reducing thermoplastic material compression mold c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for reducing thermoplastic material compression mold c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for reducing thermoplastic material compression mold c will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1244519

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.