Apparatus for reducing delamination within a polycide structure

Details Apparatus for reducing delamination within a polycide structure Apparatus for reducing delamination within a polycide structure

1996-07-26

2000-08-08

Gravini, Stephen

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

34202, 34218, F26B 2106

Patent

active

060983043

ABSTRACT:
A method and apparatus is disclosed for reducing delamination within a polycide structure. The apparatus is a purge box added to a vapor etcher structure that surrounds a cassette of silicon wafers both before and after the vapor etch process. The box contains a continuous flow of nitrogen. A cassette of wafers is placed into the box which is designed to allow removal of an individual wafer for vapor etching and return of the wafer after etching and prior to a subsequent deposition step. The purge box includes a manifold for directing the flow of nitrogen into the box so that all wafers are constantly bathed in the nitrogen flow. The cassette of wafers remains in the purge box until transport to the next manufacturing step.

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