Stone working – Work supports
Patent
1996-11-26
1998-09-22
Eley, Timothy V.
Stone working
Work supports
125 12, 451 41, B28D 704
Patent
active
058099875
ABSTRACT:
A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer. Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.
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Akram Salman
Wark James M.
Banks Derris H.
Eley Timothy V.
Micron Technology,Inc.
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