Drying and gas or vapor contact with solids – Process – Gas or vapor pressure varies during treatment
Patent
1998-04-30
2000-09-19
Bennett, Henry
Drying and gas or vapor contact with solids
Process
Gas or vapor pressure varies during treatment
34410, 34428, F26B 318
Patent
active
061193682
ABSTRACT:
An improved cool chamber is provided which includes a gas manifold for redistributing the gas flow and reducing the velocity of the gas particles that are directed towards a wafer. The gas manifold has a generally circular body that defines a plurality of outlets. A plurality of tubes, each having a first end and a second end, extend from the body. The first end is coupled to the body at the outlets. A vent diffuser is coupled to the second end of each tube. The vent diffuser includes a sintered gasket for providing point-of-use filtering of the gas and diffusion of the gas. The gas manifold is at a height different from the height of the plane of the wafer. An adapter plate that includes a bypass port is also provided. The bypass port is employed to conduct gas from the gas manifold back into the chamber during de-pressurization.
REFERENCES:
patent: 5199483 (1993-04-01), Bahng
patent: 5937541 (1999-08-01), Weigand et al.
Bennett Henry
Conexant Systems Inc.
Drake Malik N.
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