Apparatus for recognizing the shape of a semiconductor wafer

Details Apparatus for recognizing the shape of a semiconductor wafer Apparatus for recognizing the shape of a semiconductor wafer

1998-07-06

2000-01-18

Scherbel, David A.

Stone working

Sawing

125 1301, 451 5, 451 6, B28D 104

Patent

active

060149655

ABSTRACT:
The present invention provides an apparatus for recognizing the shape of a semiconductor wafer, capable of stably achieving accurate shape recognition without being affected by either a circuit pattern formed on the semiconductor wafer or the color of an adhesive sheet attached to a frame for adhering to the semiconductor wafer. The shape recognizing apparatus for recognizing the shape of a semiconductor wafer in accordance with the present invention comprises an image pickup means for picking up an image of the semiconductor wafer and providing video signals representing the image, the image pickup means being opposite to the semiconductor wafer, and a shape recognizing means for recognizing the shape of the semiconductor wafer by processing the video signals. The shape recognizing apparatus is characterized in that; it comprises an illuminating means for illuminating a semiconductor wafer and transmitting light through the adhesive sheet with the semiconductor wafer, the illuminating means is disposed opposite to the image pickup means, and the semiconductor wafer is interposed between the illuminating means and the image pickup means.

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