Apparatus for rapid non-destructive measurement of die attach qu

Details Apparatus for rapid non-destructive measurement of die attach qu Apparatus for rapid non-destructive measurement of die attach qu

1989-10-13

1991-09-10

Williams, Hezron E.

Measuring and testing

Vibration

By mechanical waves

73599, G01N 2904

Patent

active

050463632

ABSTRACT:
A method and apparatus is disclosed for the non-destructive measurement of die-attach quality in packaged integrated circuit. The apparatus is used in a production line and uses acoustical pulses to generate signals from within the integrated circuit indicative of the die-attach quality.

REFERENCES:
Gilmore et al., "High-Frequency Ultrasonic Testing of Bonds: Application to Silicon Power Devices", Materials Evaluation (Jan. 1979), pp. 65-72.

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