Apparatus for rapid in-situ X-ray stress measurement during ther

X-ray or gamma ray systems or devices – Specific application – Diffraction – reflection – or scattering analysis

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378 79, 378 87, G01N 2320

Patent

active

058481222

ABSTRACT:
An apparatus for making rapid in-situ thermal stress measurements includes a controlled atmosphere test chamber for receiving and holding a test sample, and a heating zone within the test chamber confined to the near vicinity of the test sample. A test sample holder, a test sample heater, an x-y translation stage and a rotating stage are mounted within the test chamber. An X-ray source is positioned for producing an incident X-ray beam directed at the test sample from different inclination angles. The incident X-ray beam passes through a long but narrow X-ray window in the test chamber, diffracts from the test sample back through the same X-ray window and continues outside of the chamber to an X-ray detector. The diffracted X-ray beam is converted to light. The light is transmitted through optical fibers and is detected by a CCD array. The invention uses an advantageous scintillation material and a slow scan, fiber-optic compatible CCD photo-sensor array. This photo-sensor array enables the use of a long active detector along the 2.theta. arc and a long working distance between the test sample and the detector.

REFERENCES:
patent: 3727052 (1973-04-01), Hino
patent: 3934138 (1976-01-01), Bens
patent: 4078175 (1978-03-01), Fletcher et al.
patent: 4489425 (1984-12-01), Borgonovi
patent: 4686631 (1987-08-01), Ruud
patent: 4821302 (1989-04-01), Whitlock et al.
patent: 4821303 (1989-04-01), Fawcett et al.
patent: 5125016 (1992-06-01), Korhonen et al.
patent: 5148458 (1992-09-01), Ruud
patent: 5414747 (1995-05-01), Ruud et al.
Noyan, I.C. and Cohen, J.B., "Residual Stress," Springer-Verlag, ISBN 0-387-96378-2, (1987), pp. 4-7, 74-110, and 116-125. no month.
Noyan, I.C. and Goldsmith, C.C., "Thermal Stress Relaxation in Vapor Deposited Thin Films," Advances in X-ray Analysis, 34, 587, (1991). no month.
Crowder, C.E. et al., "The Measurement of Triaxial Residual Stress in Polymer-Coated Aluminum Circuitry in Microchip Modules," Advances In X-ray Analysis, 36, 231, (1993). no month.
Tencor FLX, "Thin Film Stress Measurement Systems," (1994). no month.

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