Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1998-07-21
2000-02-29
Yao, Sam Chuan
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
1562744, 156435, 219765, 219780, H05B 654, B32B 3100
Patent
active
060304901
ABSTRACT:
A bonding apparatus for bonding a thermoplastic pad having a predetermined peripheral shape to a first surface of a carpet using radio frequency energy includes a die electrode and a backing electrode. Both the die electrode and the backing electrode have a peripheral shape that corresponds to the peripheral shape of the pad. In addition, both the die electrode and the backing electrode may have a relief feature thereon that are correspondingly sized and located. Concentrations of electric field intensity in the vicinity of the peripheral edge of the die electrode and along the edges of the relief feature on the die electrode are minimized so that bonding of a pad to a carpet may be effected without thermal runaway. The pad is bonded to the carpet without the occurrence of localized burning of the carpet pile or perforation of the pad.
REFERENCES:
patent: 2711828 (1949-09-01), Webb et al.
Francisco Harry Bernard
Riegert Ronald Jack
E.I. Du Pont de Nemours and Company
Yao Sam Chuan
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