Dispensing – Molten metal dispensing – With heating or cooling
Patent
1982-09-23
1985-07-09
Skaggs, H. Grant
Dispensing
Molten metal dispensing
With heating or cooling
222602, 222603, 222450, 222510, 2221465, B22D 3506, B67D 562
Patent
active
045277176
ABSTRACT:
In an apparatus for quantitatively supplying melted solder, a first chamber storing the melted solder is provided with a vessel of the apparatus. A second chamber communicates with the first chamber through a first communicating hole, and communicates with a third chamber through a second communicating hole. A nozzle for supplying the melted solder is disposed at the third chamber. A valve for opening and closing the first communicating hole is disposed therein. A piston is disposed in the second communicating hole. The melted solder stored in the first chamber is moved to the second chamber when the valve is opened. Subsequently, the valve is closed, and the piston which was disposed so as not to move the melted solder from the second chamber to the third chamber, is moved toward the second chamber, thus allowing the melted solder to move from the second chamber to the third chamber. When the piston is moved back toward the third chamber, the melted solder is supplied from the nozzle. Therefore, the melted solder is quantitatively supplied regardless of the amount remaining in the vessel.
REFERENCES:
patent: 1595822 (1924-04-01), DuCharme
patent: 2564427 (1951-08-01), De Rugeris
patent: 2698015 (1954-12-01), Brown
patent: 2912143 (1959-11-01), Woolfolk
patent: 3952921 (1976-04-01), Tanner
Emoto Takao
Nagata Yoshitaka
Skaggs H. Grant
Tokyo Shibaura Denki Kabushiki Kaisha
LandOfFree
Apparatus for quantitatively supplying liquid does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for quantitatively supplying liquid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for quantitatively supplying liquid will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-905032