Apparatus for providing a substrate with viscous medium

Details Apparatus for providing a substrate with viscous medium Apparatus for providing a substrate with viscous medium

2007-04-10

2007-04-10

Koch, George (Department: 1734)

Coating apparatus

Control means responsive to a randomly occurring sensed...

C118S713000, C118S712000, C427S008000, C427S010000

Reexamination Certificate

active

09902110

ABSTRACT:
Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.

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Article by Robert Kirkpatrick—“Two-Dimensional, Closed-loop Inspection of Stencil Printing”—published in SMT/Jul. 1999.

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