Apparatus for providing a ground for circuits on carriers

Wave transmission lines and networks – Long line elements and components – Strip type

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333 99R, 361787, 361799, H01P 100

Patent

active

058120394

ABSTRACT:
A ground path for microwave circuits positioned on carriers is provided. A ground path is provided between a first and second carrier coupled to respective microwave circuit substrates. The first and second carriers are coupled to a base, forming an opening between the first and second carriers. A conductive element is coupled to a first microstrip transmission line on the first substrate and a second microstrip transmission line on the second substrate. A conductive spring is then positioned in the opening in order to create a ground path. The microstrip transmission line may consist of alumina or a high-frequency plastic, such as Teflon or Duroid.RTM.. The conductive spring may consist of beryllium copper. A conductive rubber material may also be positioned in the opening, contacting the conductive spring and the base. The conductive spring and conductive element form a transmission having an impedance of between approximately 45 ohms and 60 ohms, thereby substantially improving microwave signal quality transmitted on a substrate coupled to relatively thick carriers.

REFERENCES:
patent: 3747044 (1973-07-01), Vaccaro
patent: 3870974 (1975-03-01), Ohlstein et al.
patent: 5065124 (1991-11-01), Chrzan

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