Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1993-11-12
1994-12-27
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156626, 156643, B44C 122, H01L 21306, C03C 1500
Patent
active
053762150
ABSTRACT:
A method and apparatus for uniformizing a bonded SOI (silicon on insulator) thin film layer by the reaction of chemical vapor-phase corrosion excited by the ultraviolet light, which effect the measurement of film thickness efficiently and conveniently and consequently attaining highly accurate control of the dispersion of thickness of the thin film layer without requiring the substrate to be removed from the reaction vessel for chemical vapor-phase corrosion on each occasion of the measurement or necessitating installation of a mechanism for alteration of the position of measurement inside or outside the reaction vessel are disclosed. The measurement of film thickness is carried out by keeping observation of interference fringes due to distribution of thickness of the film layer.
REFERENCES:
patent: 5091320 (1992-02-01), Aspnes et al.
patent: 5223080 (1993-06-01), Ohta et al.
Abe Takao
Katayama Masatake
Nakano Masatake
Ohta Yutaka
Powell William
Shin-Etsu Handotai & Co., Ltd.
Snider Ronald R.
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