Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1988-11-21
1991-04-09
Schor, Kenneth M.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156643, 20429806, 20429834, 118715, 118723, 134 1, H01L 21304, C23C 1400
Patent
active
050061925
ABSTRACT:
An apparatus for treating wafers utilizing the plasma produced by a gas discharge and a method of cleaning such apparatus are disclosed. The apparatus is equipped with a device for forming a high voltage electric field in a space outside of the discharge space in which the wafer treating plasma is generated. The cleaning of the inner surfaces of the vacuum vessel of the apparatus is effected during the periods between the treatments by means of the plasma generated by the gas discharge started and sustained by the electric field device as well as by a main electrode for maintaining the treating discharge. The device for forming a high voltage electric field as mentioned above may comprise a limiter electrode surrounding the treating discharge space; alternatively, it may comprise an auxiliary electrode disposed in the space outside the treating discharge space. First, an etching gas capable of etching the films deposited on the inner surfaces of the vessel of the apparatus is introduced into the vessel as the discharge gas in the cleaning process; next, hydrogen is introduced into the vessel to remove the impurities adsorbed on the surfaces of the vessel. The etching gas may comprise hydrogen or argon.
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Noda et al., "Study of the Discharge Cleaning Process in JIPP T-11 Torus by Residual Gas Analyzer", J. Vac. Sci. Technol. A 1(3), Jul.-Sep. 1983.
Burns Todd J.
Mitsubishi Denki & Kabushiki Kaisha
Schor Kenneth M.
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