Apparatus for producing semiconductor device

Details Apparatus for producing semiconductor device Apparatus for producing semiconductor device

1993-04-16

1994-07-26

Thomas, Tom

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

29 2501, 29 2502, 437209, 437226, H01L 2156

Patent

active

053324064

ABSTRACT:
A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.

REFERENCES:
patent: 4296542 (1981-10-01), Gotman
patent: 4590667 (1986-05-01), Simon
patent: 4897141 (1990-01-01), Girard
patent: 4914815 (1990-04-01), Takada et al.
patent: 4999242 (1991-03-01), Ishiwata et al.
"Automatic Wafer Mounting System", Disco Abrasive Systems, DFM-A150, Nov. 1983.
"Fully Automatic, In-Line Wafer Mounting/Dicing/Cleaning System", Disco Abrasive Systems, Nov. 1983.

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