Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1990-11-13
1993-08-03
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
101123, 101124, 1011284, B05C 100
Patent
active
052325440
ABSTRACT:
A dual-purpose apparatus for selectively applying an emulsion onto a mesh screen of a screen printing plate and attaching an emulsion layer-containing film to the screen, comprises a printing plate support for supporting the screen printing plate, a film feed device for feeding the emulsion layer-containing film, a film guiding-and-cutting mechanism for guiding the emulsion layer-containing film along the mesh screen of the screen printing plate, and a pressing-and-applying mechanism for pressing the emulsion layer-containing film and for applying the emulsion onto the mesh screen. The pressing-and-applying mechanism includes a support for replaceably supporting a pressure roller unit or an emulsion bucket.
REFERENCES:
patent: 3889629 (1975-06-01), Black
patent: 4363289 (1982-12-01), Gasser
patent: 4509455 (1985-04-01), Shirataki
patent: 4524688 (1985-06-01), Glantschnig
patent: 4628814 (1986-12-01), Klemm
patent: 4668329 (1987-05-01), Shirataki
patent: 4876957 (1989-10-01), Sakai
patent: 4937097 (1990-06-01), Ichinose et al.
patent: 5027703 (1991-07-01), Hancy
Engel, Jr. James J.
Simmons David A.
Tokai Seiki Co., Ltd.
Tokai Shoji Co. Ltd.
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