Apparatus for processing substrates

Details Apparatus for processing substrates Apparatus for processing substrates

1998-03-20

2000-06-13

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

414331, 414404, 414416, 4147441, 414936, 414937, 414938, 414940, 414941, 134 251, 134 254, 134 61, 134 76, 134143, 134902, 118 73, 118423, C23F 102, B08B 1300, B65G 4907, B05C 1100, B05C 302

Patent

active

060745150

ABSTRACT:
In a substrate processing apparatus receiving substrates held in a common carrier in a horizontal attitude, the substrates are transferred in the horizontal attitude from the common carrier to an exclusive carrier. The exclusive carrier is rotatable on a horizontal axis. By rotating the exclusive carrier, the substrates are turned from the horizontal attitude to a vertical attitude. Then, the substrates held in the vertical attitude are taken out of the exclusive carrier and transferred to a processing part for processing in the vertical attitude. This allows a simple and speedy turn of the plurality of substrates. Further, even the apparatus for processing the substrates in a vertical attitude can transfer the substrates into and out of the apparatus in the horizontal attitude by using the common carrier.

REFERENCES:
patent: 4744815 (1988-05-01), Kawabata
patent: 5180273 (1993-01-01), Sakaya et al.
patent: 5240557 (1993-08-01), Dyer et al.
patent: 5324155 (1994-06-01), Goodwin et al.
patent: 5356261 (1994-10-01), Nishi
patent: 5374153 (1994-12-01), Nishi
patent: 5387265 (1995-02-01), Kakizaki et al.
patent: 5464313 (1995-11-01), Ohsawa
patent: 5590672 (1997-01-01), Ohmori et al.
patent: 5668452 (1997-09-01), Villarreal et al.
patent: 5810538 (1998-09-01), Ozawa et al.
patent: 5862826 (1999-01-01), Kamikawa et al.
patent: 5947675 (1999-09-01), Matsushima
patent: 5954472 (1999-09-01), Hofmeister et al.
patent: 5971696 (1999-10-01), Endo et al.
patent: 5980186 (1999-11-01), Cheng

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