Apparatus for processing silicon devices with improved temperatu

Electric heating – Heating devices – With power supply and voltage or current regulation or...

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374123, H05B 302

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060021136

ABSTRACT:
Apparatus for processing a silicon workpiece uses reflected UV light to measure and control the workpiece temperature. A linearly polarized beam including UV light is directed onto a silicon surface to produce a reflected beam. The reflected beam is cross-polarized to null out much of the light, and the resulting residual reflectivity spectrum is determined. The temperature is determined from the characteristics of this spectrum. A workpiece heating station uses this measuring technique to accurately control the temperature of a silicon workpiece and temperature-dependent processing over a wide range of processing temperatures, including temperatures below 500.degree. C.

REFERENCES:
patent: 5022765 (1991-06-01), Guidoti et al.
patent: 5098199 (1992-03-01), Amith
patent: 5118200 (1992-06-01), Kirillov et al.
patent: 5154512 (1992-10-01), Schietinger et al.
patent: 5166080 (1992-11-01), Schietinger et al.
patent: 5258602 (1993-11-01), Naselli et al.
patent: 5310260 (1994-05-01), Schietinger et al.
patent: 5318362 (1994-06-01), Schietinger et al.
patent: 5325181 (1994-06-01), Wilman
patent: 5388909 (1995-02-01), Johnson et al.
patent: 5490728 (1996-02-01), Schietinger et al.
patent: 5568978 (1996-10-01), Johnson et al.
patent: 5669979 (1997-09-01), Elliott et al.
patent: 5686674 (1997-11-01), Lowry et al.
patent: 5703342 (1997-12-01), Hoffmann et al.
patent: 5825478 (1998-10-01), Wilcox et al.
C. Schietinger, B. Adams, and C. Yarling, Mat. Res. Soc. Symp. Proc. 224,23 (1991).
B. Nguyenphu, M. Oh and A.T. Fiory, Mat. Res. Soc. Symp. Proc. 429, 291 (1996).
Minseok Oh, Et Al. Impact Of Emissivity-Independent Temperature Control In Rapid Thermal Processing,Mat. Res. Soc. Symp. Proc. vol. 470, 1997, pp. 43-48.
Philipp and Ehrenreich, Phys. Rev. vol. 129, p. 1550 (1963).
D. Peyton, H. Kinoshita, G.Q. Lo and D.L. Kwong, Proc. SPIE, 1393, 295 (1990).
T.P. Murray, Rev. Sci. Instrum. 38, 791, (1967).
G.P. Hansen, S. Krishnan, R.H. Hauge, and J.L. Margrave, Metall. Trans. A 19A, 39 (1988).
B. Peuse, A. Rosenkrans, and K. Snow, Proc SPIE 1804, 45 (1992).
T. Loarer, J.J. Greffet, and M. Huetz-Aubert, Appl. Opt. 29, 979 (1990).
D.W. Voorhes and D.M. Hall, Proc. SPIE 1595, 61 (1991).
D. Guidotti and J.G. Wilman, Appl. Phys. Lett. 60, 524 (1991).
D. Guidotti and J.G. Wilman, J. Van. Sci. Technol. A 10, 3184 (1992).
T. Sato, Jpn J. Appl. Phys. 6, 339 (1967).

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