Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1974-09-30
1976-06-22
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
134108, 134159, 156 17, H01L 750
Patent
active
039649571
ABSTRACT:
Circular wafers of semiconductor (silicon) are chemically treated, e.g., etched, by supporting the wafers vertically by contacting their edges with annularly grooved drive rollers, immersing the supported wafers in a body of chemical medium (e.g., etchant solution) for treatment, and rotating the wafers by rotation of the drive rollers while the wafers are immersed in the body of medium to uniformly and precisely treat the surfaces of the wafers. Apparatus for effecting such precision etching includes an etchant tank, a wafer rack including the drive rollers which support the edges of the wafers in vertical face-to-face relationship, the rack being lowered into the etchant to immerse the wafers. Means is disclosed for rotating the drive rollers for rotation of the immersed wafers and provision is included for circulating the etchant for causing uniform flow thereof past the rotating wafers. A heat exchanger maintains the etchant substantially at a predetermined temperature.
REFERENCES:
patent: 1104139 (1914-07-01), Rodda
patent: 3632462 (1972-01-01), Barrington
patent: 3679517 (1972-07-01), Schulten et al.
patent: 3869313 (1975-03-01), Jones et al.
IBM Technical Disclosure Bulletin, Vol. 8 No. 12, May 1966, p. 1845, Semiconductor Wafer Handling Apparatus for Chemical Etching Operations by C. E. Hallas, Jr.
Gilster Peter S.
Monsanto Company
Powell William A.
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