Apparatus for processing semiconductor packages and the like

Presses – Plural diverse presses

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

72405, 72452, 100207, 100208, 100215, 100292, B30B 700, B30B 126, B30B 1530

Patent

active

050484125

ABSTRACT:
In a press for cutting and bending the leads of semiconductor packages, a series of cams on a common drive shaft operate both the feeding mechanism and the working presses to achieve high speed operation, up to 500 cycles per minute, through accurate timing and avoidance of delays inherent in fluid-operated presses. The path of movement of the packages through the apparatus is linear, and the axis of the camshaft is parallel to the path of movement.

REFERENCES:
patent: 3199358 (1965-08-01), Bradlee
patent: 3557599 (1971-01-01), Eickenhorst
patent: 3779155 (1973-12-01), Ohno
patent: 4354790 (1982-10-01), Karl

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for processing semiconductor packages and the like does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for processing semiconductor packages and the like, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for processing semiconductor packages and the like will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1908558

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.