Apparatus for processing a sample having a metal laminate

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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156643, 156345, 134 13, H01L 21306

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active

060368160

ABSTRACT:
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.

REFERENCES:
patent: 4450033 (1984-05-01), Little
patent: 4487678 (1984-12-01), Noguchi et al.
patent: 4571685 (1986-02-01), Kamoshida
patent: 4844719 (1989-07-01), Toyomoto et al.
patent: 4877757 (1989-10-01), York et al.
Patent Abstracts of Japan, JP-A-55 072040, vol. 004, No. 117 (E-022), Aug. 20, 1980, Mitsubishi Electric Corp.
Database WPI, Derwent Publications Ltd., JP-A-63 157870, Jun. 30, 1988, Nichiden Anelba KK. (Abstract).
Database WPI, Derwent Publications Ltd., JP-A-63 204726, Aug. 24, 1988, Anelva Corp. (Abstract).

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