Apparatus for processing a planar structure

Details Apparatus for processing a planar structure Apparatus for processing a planar structure

1999-05-05

2000-09-19

Gerrity, Stephen F.

Abrading

Machine

Combined

451 41, 451388, 451394, 451402, B24B 700

Patent

active

061203602

ABSTRACT:
A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for supporting wafer portions in position to be ground to a desired thickness. In another aspect of the invention, adhesive material is employed to individually secure wafer portions in position during the grinding process.

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