Apparatus for processing a molded carrier ring device

Wireworking – Crimping

Patent

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Details

29559, 29827, 72420, 72465, 83622, B21D 3712

Patent

active

050709160

ABSTRACT:
An apparatus is provided for receiving a molded carrier ring package and removing the electronic component from the surrounding ring while cutting and forming the leads of the component. The shear provides that leads on two opposite sides of a rectangulopiped component are cut just prior to the leads extending from the remaining two sides, during one stroke of the shear, such that the applied force required to cut all of the leads is reduced by acting on one-half of the leads at a time, and such that the applied forces are balanced on opposite sides of the component. Each of a punch and die is easily interchanged with a replacement, and a scrap remover is continuously adjustable during closing of the jaws thereof, so that it is a simple matter to change the tooling and otherwise accommodate devices of different sizes. Also, the apparatus provides for diverting the forces of the shearing and forming action from a shuttle for transporting the device so as to minimize wear and tear on it.

REFERENCES:
patent: 3232158 (1966-01-01), Breeding
patent: 4352309 (1982-10-01), Thalstrom et al.
patent: 4945954 (1990-08-01), Wehrly, Jr.
patent: 4957146 (1990-09-01), Satterfield et al.

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