Apparatus for printing solder paste to a printed circuit board a

Printing – Stenciling – Stencil and work support

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

101129, B41F 1526

Patent

active

057352038

ABSTRACT:
An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

REFERENCES:
patent: 4902371 (1990-02-01), Andris et al.
patent: 5174201 (1992-12-01), Andris et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for printing solder paste to a printed circuit board a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for printing solder paste to a printed circuit board a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for printing solder paste to a printed circuit board a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4783

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.