Apparatus for preventing wire sag in the wire bonding process fo

Details Apparatus for preventing wire sag in the wire bonding process fo Apparatus for preventing wire sag in the wire bonding process fo

1981-02-17

1983-04-05

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228180A, 29589, 29827, 29860, H05K 104

Patent

active

043789021

ABSTRACT:
In an apparatus for the assembly of microcomponents semiconductor devices, an improvement is provided for the step involving wire bonding of thin gold wires between conductor pads on the semiconductor chip and the external leads. In this type of apparatus generally, the wire bonding step involves the bonding of thin gold conductor wires between the conductor pads and the external leads. In the type apparatus wherein the present invention is provided, a lower anvil articular upward to a position underneath and supporting the semiconductor chip during the bonding process and then articulates downward away from the chip after bonding. The wires are placed and bonded by a capillary tube which articulates between positions above the bonding pads of the chip and the leads. The improvement comprises a wall disposed from the lower anvil and surrounding the chip between the conducting pads and the leads, whereby the wires are supported by the wall as they are withdrawn from the capillary tube.

REFERENCES:
patent: 3934336 (1976-01-01), Morse
patent: 4053096 (1977-11-01), Heim
patent: 4063990 (1977-12-01), Volz et al.
patent: 4140265 (1979-02-01), Morino

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