Apparatus for preventing the formation of condensation on sub-co

Details Apparatus for preventing the formation of condensation on sub-co Apparatus for preventing the formation of condensation on sub-co

1995-07-24

1996-11-12

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

62150, 16510424, 219209, 257715, 361699, H05K 720

Patent

active

055746276

ABSTRACT:
Resistive ink elements are applied to the exposed surfaces of thin sections or thermal insulation provided to cooled integrated circuit devices within a computer system. The insulation is made thinner than required to prevent the formation of condensation upon the exposed surfaces of the insulation in order to accommodate space limitations within the computer system. The resistive ink elements generate heat upon the application of an electrical current thereto to warm the exposed surfaces of the insulation to a temperature above the dew point of the ambient environment within the computer system, thereby preventing the formation of condensation on the surfaces on the insulation.

REFERENCES:
patent: 3289046 (1966-11-01), Carr
patent: 4374316 (1983-02-01), Inamori
patent: 4739382 (1988-04-01), Blouke
patent: 4897762 (1990-01-01), Daikoku
patent: 5331273 (1994-07-01), Schneider
patent: 5365749 (1994-11-01), Porter

Affiliated with

Also associated with

Rating

Apparatus for preventing the formation of condensation on sub-co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for preventing the formation of condensation on sub-co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for preventing the formation of condensation on sub-co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-567912