Gas separation – With separating media bypass or system gas pressure relief – Valved bypass means
Patent
1991-05-31
1992-06-16
Nozick, Bernard
Gas separation
With separating media bypass or system gas pressure relief
Valved bypass means
553852, 55387, B01D 5000
Patent
active
051221705
ABSTRACT:
An apparatus for preventing clouding of a mirror-finished semiconductor wafer in a semiconductor wafer treating zone by controlling an internal atmosphere in the semiconductor wafer treating zone. The apparatus has an air conditioner for introducing the air from an external environment into the semiconductor wafer treating zone, and a removing device disposed in the air conditioner or between the air conditioner and the external environment for removing at least part of the sulfur oxides out of the sulfur oxides and nitrogen oxides in the air introduced from the external environment. The air introduced through the air conditioner and the cleaning device forms an atmosphere including a sulfur oxide concentration of 60 ng/l or less in the semiconductor wafer treating zone.
REFERENCES:
patent: 4684510 (1987-08-01), Harkius
patent: 4737173 (1988-04-01), Kudirka et al.
Ogawa Yohji
Okano Hirofumi
Satoh Kazuo
Suzuki Kiyomi
Nozick Bernard
Toshiba Ceramics Co. Ltd.
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