Apparatus for preserving solder paste in the manufacturing of pr

Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – With housing surrounding or engaging coating means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118213, 118406, 118504, 118505, 427 96, 427272, 427282, 1011271, B05C 2100

Patent

active

058764984

ABSTRACT:
A device for preserving solder paste in the manufacturing of printed circuit board assemblies. In one embodiment, the preserving device has a frame adapted to be positioned on a stencil plate of a solder paste stenciling machine and a cover coupled to the frame. The frame has a wall that is configured to substantially surround at least a portion of the solder paste on the stencil plate between printing cycles. In a preferred embodiment, the wall is configured to surround a working region on the stencil plate defined by the area on the stencil plate that the solder paste contacts during a printing cycle. The cover is coupled to the frame to form a protective compartment that substantially houses the solder paste between printing cycles. As a result, the preserving device restricts the airflow across the solder paste to protect the solder paste from environmental elements within the stenciling machine.

REFERENCES:
patent: 4784310 (1988-11-01), Metzger et al.
patent: 5400914 (1995-03-01), Lin
patent: 5622108 (1997-04-01), Benedetto et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for preserving solder paste in the manufacturing of pr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for preserving solder paste in the manufacturing of pr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for preserving solder paste in the manufacturing of pr will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-418288

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.