Apparatus for preforming wire leads and alignment for bonding

Details Apparatus for preforming wire leads and alignment for bonding Apparatus for preforming wire leads and alignment for bonding

1976-10-04

1978-01-31

Smith, Al Lawrence

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

29591, 228 51, 228 6A, B23K 2102, H01L 21601

Patent

active

040711803

ABSTRACT:
In an apparatus for preforming the ends of wire leads of lead frames, prior to bonding, the lead frames are fed successively through a preforming position. A positioning and alignment device is provided correctly positioning the lead frames prior to preforming, the device using as datum surfaces, surfaces used to position the lead frames during manufacture. Typically the lead frames are produced on perforated strip film and the perforations act as positioning datum surfaces during manufacture and during preforming. After preforming the lead frames are fed to a bonding position for automatic bonding, as by an ultrasonic wobble bonding tool.

REFERENCES:
patent: 3882597 (1975-05-01), Chayka
patent: 3887783 (1975-06-01), Comette
patent: 3938722 (1976-02-01), Kelly
patent: 3968563 (1976-07-01), Hamlin
Grossman, Electronics, "Film-Carrier Technique Automates the Packaging of IC Chips," May 16, 1974, pp. 89-95.

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