Apparatus for precise alignment and placement of optoelectric co

Metal working – Means to assemble or disassemble – With signal – scale – illuminator – or optical viewer

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Details

29743, 29DIG22, 29DIG44, B23P 1904, H05K 330

Patent

active

055904564

ABSTRACT:
An apparatus and method is provided that superimposes an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

REFERENCES:
patent: 4889921 (1990-02-01), Bendat et al.
patent: 5018936 (1991-05-01), Izumi et al.
patent: 5033783 (1991-07-01), Izumi et al.
patent: 5195234 (1993-03-01), Pine et al.
patent: 5212880 (1993-05-01), Nishiguchi et al.
"Arrangement for Component Position Pre-Evaluation Using Vision and Turret Head" IBM Technical Disclosure Bulletin, vol. 30, No. 10, Mar. 1988, pp. 40-41.

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