Apparatus for pre-conditioning CMP polishing pad

Details Apparatus for pre-conditioning CMP polishing pad Apparatus for pre-conditioning CMP polishing pad

2006-09-12

2006-09-12

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

C451S072000

Reexamination Certificate

active

07105446

ABSTRACT:
An apparatus and method suitable for the pre-conditioning of a polishing pad on a CMP apparatus prior to the polishing of production wafers on the apparatus. The apparatus includes a pre-conditioning arm on which is mounted an ingot of suitable material. In use, the ingot is pressed against the polishing surface of the rotating polishing pad for a selected period of time to increase the temperature of the polishing surface by friction. The pre-conditioned polishing pad facilitates uniform polishing rates of production semiconductor wafers subsequently polished on the apparatus.

REFERENCES:
patent: 6273798 (2001-08-01), Berman
patent: 2002/0098779 (2002-07-01), Tsai et al.
patent: 2004/0259477 (2004-12-01), Anderson

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