Apparatus for positioning integrated circuit packages for tinnin

Details Apparatus for positioning integrated circuit packages for tinnin Apparatus for positioning integrated circuit packages for tinnin

1992-08-06

1993-11-23

Rosenbaum, Mark

Metal fusion bonding

With means to handle work or product

Including means to orient work or position work portion...

228260, 269903, B23K 3704

Patent

active

052636321

ABSTRACT:
A fixture for positioning high density packaged integrated circuits for tinning which includes a clamp bar assembly pivotally attached to a base. The base includes recessed nests in which the high density packages are positioned. The high density packages are secured in the nests by the clamp bar assembly. The top surfaces of the high density packages are protected from the solder wave by the base. A predetermined spacing and orientation of the nests ensures proper tinning.

REFERENCES:
patent: 4700935 (1987-10-01), Winslow et al.
patent: 4747532 (1988-05-01), Sim
patent: 4871106 (1989-10-01), Wharff

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