Apparatus for polishing wafers

Details Apparatus for polishing wafers Apparatus for polishing wafers

1996-12-19

1999-01-19

Morgan, Eileen P.

Abrading

Machine

Rotary tool

451 41, 451287, B24B 722, B24B 3704

Patent

active

058608532

ABSTRACT:
An apparatus for polishing wafers comprising a turn table with a polishing pad fixedly extended thereon, at least one polishing head positioned above a point on the turn table spaced by a distance from its center, a plate mounted on a lower surface of the at least one polishing head, and a carrier, which is used for retaining the wafers, mounted on the plate in a manner such that the carrier is freely rotatable relative to the plate, wherein a backing pad which is used to press the wafers is fixed on the plate and the wafers are rotated around their respective centers, while being revolved around the center of the plate. According to the apparatus, polished wafers with an excellent flatness are obtained in a reliable manner.

REFERENCES:
patent: 3841031 (1974-10-01), Walsh
patent: 4258508 (1981-03-01), Wilson et al.
patent: 4918870 (1990-04-01), Torbert et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5361545 (1994-11-01), Nakamura
patent: 5584751 (1996-12-01), Nakazuma et al.
patent: 5647789 (1997-07-01), Kitta et al.

Affiliated with

Also associated with

Rating

Apparatus for polishing wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for polishing wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for polishing wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1242906