Apparatus for polishing wafer

Details Apparatus for polishing wafer Apparatus for polishing wafer

1995-09-05

1997-04-08

Gorski, Joseph M.

Abrading

Machine

Rotary tool

451 66, 451289, 451290, 451334, 451 67, B24B 704, B24B 722

Patent

active

056182279

ABSTRACT:
There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, an upper polishing plate assembly, a second rotating mechanism for rotating the upper polishing plate assembly, a pressing mechanism, a conveying mechanism and a discharging mechanism. The lower polishing plate assembly includes a lower polishing plate, a polishing pad, a porous sheet interposed between the lower polishing plate and the polishing pad. The porous sheet has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly includes an upper polishing plate, a plate-like chuck and a backing pad, a pressure reducing unit, and a cleaning unit.

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