Apparatus for polishing the periphery portion of a wafer

Abrading – Machine – Reciprocating tool

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451 44, B24B 900

Patent

active

054764130

ABSTRACT:
An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.

REFERENCES:
patent: 2258733 (1941-10-01), Brackett
patent: 3806956 (1974-04-01), Supkis et al.
patent: 5117590 (1992-06-01), Kudo et al.
patent: 5148639 (1992-09-01), Sakai et al.
patent: 5185965 (1993-02-01), Ozake
patent: 5209027 (1993-05-01), Ishida et al.
patent: 5271185 (1993-12-01), Hosokawa
patent: 5316620 (1994-05-01), Hasegawa et al.

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