Abrading – Machine – Rotary tool
Patent
1997-03-04
1999-07-13
Eley, Timothy V.
Abrading
Machine
Rotary tool
451 6, 451 8, 451290, 451533, 451538, B24B 2902, B24B 4912, B24D 1100
Patent
active
059218533
ABSTRACT:
An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.
REFERENCES:
patent: 2998680 (1961-09-01), Lipkins
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 3863395 (1975-02-01), Brown
patent: 3982358 (1976-09-01), Fukuda et al.
patent: 4598502 (1986-07-01), Lombard
patent: 4928438 (1990-05-01), Narimatsu et al.
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 4954142 (1990-09-01), Carr et al.
patent: 5104828 (1992-04-01), Morimoto et al.
patent: 5172448 (1992-12-01), Kitahata
patent: 5433650 (1995-07-01), Winebarger
patent: 5441444 (1995-08-01), Nakajima
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5454750 (1995-10-01), Cosmano et al.
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5624304 (1997-04-01), Pasch et al.
patent: 5649855 (1997-07-01), Chikaki
Research Disclosure, Feb. 1991, No. 322, p. 95 "Pressure Wafer Holder for Uniform Polishing".
Eley Timothy V.
Matsushita Electric - Industrial Co., Ltd.
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