Apparatus for polishing semiconductor wafers and method of testi

Details Apparatus for polishing semiconductor wafers and method of testi Apparatus for polishing semiconductor wafers and method of testi

1998-06-02

2000-09-05

Eley, Timothy V.

Abrading

Machine

Rotary tool

451388, B24B 2900

Patent

active

061134805

ABSTRACT:
A semi-conductor wafer polishing head includes three air lines for controlling three respective head functions, and an air control system providing precise head control and functional checking of each head sub-system, including air line pressure checking and chamber leak rate testing. The control system includes electrically operated valves for selectively coupling air chambers in the head with either a source of pressurized air, a source of negative air pressure, or a vent to atmosphere. A pair of air gauges are employed to check chamber leak rate respectively during positive and negative air pressure tests.

REFERENCES:
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5803799 (1998-09-01), Volodarsky et al.
patent: 5913718 (1999-06-01), Shendon
patent: 5916015 (1999-06-01), Natalicio

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